I’ve been potting packs with Techno Potting 3055. Which is a great product from a reliable company. Just expensive. Though after now trying to tear apart a pack to salvage from a dead cell situation, I’m wondering again why a simple non acid cure Mold making silicone wouldn’t be adequate (currently using it on other parts of assemblies due to cost saving).
Oddly enough, I found 3055 to be quite structurally solid but after a certain point it tears a lot more easily than silicone. So there’s a tradeoff there. Are the thermal properties much better in real world use (I know they are on paper)? Is the mechanical bond improvement something we need?
Anyhow, just curious what others have done and where the trade offs were in your own testing.