really nice!
Here are photos of opening my last VESC that died from water. Following your approach: on the 4th photo, thermal paste should be applied on the 12 black squares ?
Or you can just change Tracking to Muted and you won’t be notified at all about new activity in a thread.
The black squares are the mosfets, they will generate most of the heat that needs to be handled.
It seems that this esc is a single PCB that is double sided. This design is harder to keep cool than some of the two pcb stacked designs, at least in an efoil application. In the thread I linked above the esc is a Flipsky 75200, it has the two layer design with all the mosfets on their own pcb on the bottom and there’s an integrated aluminum plate. That integrated plate is what gets pressed onto a larger cooling plate with thermal paste. You could still press your esc against a larger cooling plate. Maybe better to reuse the pink silicone cooling pad that came inside the original case. You will need to figure out some way to have the esc fastened down and pressed against the larger plate. Maybe small brackets, maybe small screws passed through the holes in the pcb.
it’s nice that Flipsky does that, better than Maytech
Cooling pad is better than thermal paste on the mosfets?
I think the pad might be better in this case because it may offer more protection. I doubt pressing mosfets directly onto metal with paste is a good idea. Could damage them and cause a short.
okay i see thanks a lot!